3D CHIP(IC)
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3-D ICs are an attractive chip architecture that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip (SoC). The multi-layer chip industry opens up a whole new world of design. With the Introduction of 3-D ICs, the world of chips may never look the same again.
The three dimensional (3-D) chip design strategy exploits the vertical dimension to alleviate the interconnect related problems and to facilitate heterogeneous integration of technologies to realize system on a chip (SoC) design. By simply dividing a planar chip into separate blocks, each occupying a separate physical level interconnected by short and vertical interlayer interconnects (VILICs), significant improvement in performance and reduction in wire-limited chip area can be achieved.
In the 3-Ddesign architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.
The unprecedented growth of the computer and the Information technology industry is demanding Very Large Scale Integrated (VLSI) circuits with increasing functionality and performance at minimum cost and power dissipation. VLSI circuits are being aggressively scaled to meet this Demand, which in turn has some serious problems for the semiconductor industry.
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This post was written by: Rajendra Prasad
Rajendra Prasad is a professional blogger, web designer and front end web developer. Follow him on Facebook
